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Chemical Vapor Deposition (CVD) involves the vaporization, supply and control of source chemicals to a deposition chamber, which is typically held at low pressure. The gasses mix and react at the surface of the heated sample (substrate) thus depositing a film. A typical 'run' involves a heating preriod, a few minutes to several hours of process time, and a cooling period. Because of the gaseous nature of the reactants, the process lends itself to conformal coating of parts.

Advantages:
-A wide variety of coating materials are possible.
- Very good control of process and film stoichiometry.
- Very good coating density/control and conformal coverage.
- Numerous variations of the basic process integrate well with other processing techniques.

Disadvantages:
- Cost of equipment, especially for multi-step processes
- Generally a batch process.
- Sometimes, just getting a process and system "tuned in".